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dc.contributor.authorLin, HNen_US
dc.contributor.authorChen, HWen_US
dc.contributor.authorKo, CHen_US
dc.contributor.authorGe, CHen_US
dc.contributor.authorLin, HCen_US
dc.contributor.authorHuang, TYen_US
dc.contributor.authorLee, WCen_US
dc.date.accessioned2014-12-08T15:18:31Z-
dc.date.available2014-12-08T15:18:31Z-
dc.date.issued2005-09-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2005.853640en_US
dc.identifier.urihttp://hdl.handle.net/11536/13325-
dc.description.abstractChannel backscattering characteristics of uniaxially strained nanoscale CMOSFETs are reported for the first time. Channel backscattering ratio increases and decreases under uniaxial tensile and compressive strain, respectively. It is found that in sub-100-nm devices, strain-induced modulation of carrier mean-free path for backscattering and reduction in kBT layer thickness are responsible for the different behaviors of backscattering ratio. Nevertheless, the source-side injection velocity improves irrespective of the strain polarities. The impact of channel backscattering ratio on drive current is also analyzed in terms,of ballistic efficiency and injection velocity.en_US
dc.language.isoen_USen_US
dc.subjectMOSFETsen_US
dc.subjectscatteringen_US
dc.subjectuniaxial strainen_US
dc.titleChannel backscattering characteristics of uniaxially strained nanoscale CMOSFETsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2005.853640en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume26en_US
dc.citation.issue9en_US
dc.citation.spage676en_US
dc.citation.epage678en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000231577900026-
dc.citation.woscount12-
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