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dc.contributor.authorChi, Li-Jenen_US
dc.contributor.authorYu, Ming-Jiueen_US
dc.contributor.authorChang, Yu-Hongen_US
dc.contributor.authorHou, Tuo-Hungen_US
dc.date.accessioned2017-04-21T06:56:31Z-
dc.date.available2017-04-21T06:56:31Z-
dc.date.issued2016-04en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2016.2535124en_US
dc.identifier.urihttp://hdl.handle.net/11536/133433-
dc.description.abstractTo enable monolithic three-dimensional integration of the amorphous In-Ga-Zn-O (a-IGZO) and CMOS technologies, the a-IGZO inverters compatible with the low operating voltage (<= 1 V) and process temperature of back-end-of-line CMOS have been investigated. We demonstrated a full-swing depletion-load inverter with a voltage gain up to 24 using a CMOS-compatible operating voltage of 1 V. The drive transistor was realized using a low-voltage enhancement-mode a-IGZO thin-film transistor (TFT) with a steep subthreshold swing of 70 mV/decade and a low threshold voltage of 0.5 V. The load transistor was implemented using a bi-layer a-IGZO channel, where the a-IGZO composition was modulated simply by the oxygen flow rate in a depletion-mode TFT.en_US
dc.language.isoen_USen_US
dc.subjectAmorphous InGaZnO (a-IGZO)en_US
dc.subjectthin-film transistors (TFTs)en_US
dc.subjectinverteren_US
dc.subjectmonolithic 3Den_US
dc.title1-V Full-Swing Depletion-Load a-In-Ga-Zn-O Inverters for Back-End-of-Line Compatible 3D Integrationen_US
dc.identifier.doi10.1109/LED.2016.2535124en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume37en_US
dc.citation.issue4en_US
dc.citation.spage441en_US
dc.citation.epage444en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000373129300023en_US
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