標題: Finite Element Analysis of an Ultrasonic Vibration Device at High Temperatures
作者: Lan Phuong Nguyen
Tsai, Yen-Pin
Hung, Jung-Chung
Hsieh, Yi-Chun
Hung, Chinghua
機械工程學系
Department of Mechanical Engineering
關鍵字: finite element analysis;ultrasonic vibration device;high temperature
公開日期: Jun-2016
摘要: Ultrasonic-vibration-assisted forming has been extensively adopted in plastic manufacturing processes. Ultrasonic vibration contributes to enhancing material formability and product quality and to reducing manufacturing costs by improving frictional conditions and increasing the temperature of materials. However, designing a suitable ultrasonic vibration system for processes conducted at high working temperatures, such as the ultrasonic vibration-assisted glass hot embossing process, is difficult because of complex thermal boundaries and material properties. In this study, an ultrasonic vibration system that can be used at high working temperatures was analyzed using the finite element method and ANSYS commercial software. The simulation results obtained from thermal, modal, and harmonic response analyses were compared with experimental measurements to confirm the validity of the numerical analysis. The resulting finite element module can be used in designing the components of ultrasonic vibration devices that can be used at high working temperatures.
URI: http://hdl.handle.net/11536/134039
ISSN: 0257-9731
期刊: JOURNAL OF THE CHINESE SOCIETY OF MECHANICAL ENGINEERS
Volume: 37
Issue: 3
起始頁: 193
結束頁: 200
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