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dc.contributor.authorTiwari, Nidhien_US
dc.contributor.authorChauhan, Ram Narayanen_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorShieh, Han-Ping D.en_US
dc.date.accessioned2019-04-03T06:40:10Z-
dc.date.available2019-04-03T06:40:10Z-
dc.date.issued2016-01-01en_US
dc.identifier.issn2046-2069en_US
dc.identifier.urihttp://dx.doi.org/10.1039/c6ra13208aen_US
dc.identifier.urihttp://hdl.handle.net/11536/134169-
dc.description.abstractDual active channel IZO/IGZO thin film transistors as such and with ZnO interlayer are fabricated and characterized to investigate the impact of ultra-thin ZnO insertion on their performance and bias stability. The ZnO interlayer suppresses the pre-existing divalent zinc vacancies and oxygen vacancies in the IZO front layer as systematically investigated by photoluminescence and XPS analysis. This interlayer leads to an enhancement of the electrical characteristics and stability of the bilayer TFT in comparison to the counterpart TFTs fabricated by a single IZO and a-IGZO-channel device. A high-field effect mobility (similar to 14 cm(2) V-1 s(-1)) IZO/IGZO transistor with excellent photo-bias stability (Delta V-th similar to -2.45 V) was obtained from 2 nm ZnO insertion in between the IZO and IGZO layer-enabling backplane electronics for high-resolution and large-sized AMOLED and TFT-LCD displays.en_US
dc.language.isoen_USen_US
dc.titleModification of intrinsic defects in IZO/IGZO thin films for reliable bilayer thin film transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1039/c6ra13208aen_US
dc.identifier.journalRSC ADVANCESen_US
dc.citation.volume6en_US
dc.citation.issue79en_US
dc.citation.spage75693en_US
dc.citation.epage75698en_US
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000381513800084en_US
dc.citation.woscount3en_US
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