標題: | Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material |
作者: | Wang, Tzu-Hao Lee, Hsuan Chen, Chih-Ming Chen, Ming-Guan Hu, Chi-Chang Chen, Yu-Jie Horng, Ray-Hua 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
關鍵字: | Microstructure;Thermal;Optical;Low-temperature;Die-bonding |
公開日期: | 八月-2016 |
摘要: | A Sn/Bi bilayer was deposited on a hot air solder leveling (HASL)-treated metal-core printed circuit board (MCPCB) using electroplating as a low-temperature die-bonding material for light-emitting diode (LED). The eutectic feature of the Sn/Bi contact enabled the die-bonding process to accomplish through a liquid/solid reaction at 185 degrees C with a proper compression force. A high-temperature die-bonding structure composed of a Bi layer sandwiched by two intermetallic compounds (IMCs) formed after thermocompression. Employment of the Sn/Bi bilayer for low-temperature die-bonding prevented the LEDs from thermal stress problems, and the resulting high-temperature IMC/Bi/IMC die-bonding structure was capable of withstanding multiple bonding reactions and high temperature/current operation environment. Durability tests including mechanical, thermal, and optical performance were systematically performed and compared with other commercially available die-bonding materials (Ag paste and solder alloys). (C) 2016 Elsevier Ltd. All rights reserved. |
URI: | http://dx.doi.org/10.1016/j.microrel.2016.06.012 http://hdl.handle.net/11536/134281 |
ISSN: | 0026-2714 |
DOI: | 10.1016/j.microrel.2016.06.012 |
期刊: | MICROELECTRONICS RELIABILITY |
Volume: | 63 |
起始頁: | 68 |
結束頁: | 75 |
顯示於類別: | 期刊論文 |