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dc.contributor.authorShieh, MSen_US
dc.contributor.authorLin, YJen_US
dc.contributor.authorYu, CMen_US
dc.contributor.authorLei, TFen_US
dc.date.accessioned2014-12-08T15:18:42Z-
dc.date.available2014-12-08T15:18:42Z-
dc.date.issued2005-08-01en_US
dc.identifier.issn0168-583Xen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.nimb.2005.04.104en_US
dc.identifier.urihttp://hdl.handle.net/11536/13441-
dc.description.abstractThe effect of asymmetry tilt angle ion implantation on polysilicon thin-film transistors (TFTs) device characteristics are investigated. This asymmetric source/drain (S/D) TFTs structure exhibits low leakage current and suppressed kink effect due to the relief of higher electric field near the drain junction side. It is shown that the optimal implantation tilt angle is 30 degrees in our annealing condition. And the anomalous off-state current is more than two orders of magnitude lower than that of the conventional TFTs. By well controlled the LDD region, this structure can act as a conventional structure in the on-state and the turn-on current will not be degraded. Besides, the device under severe hot carrier bias stress shows better hot carrier endurance. (c) 2005 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectdiffusion of impuritiesen_US
dc.subjectthin-film transistorsen_US
dc.subjectasymmetric implantationen_US
dc.subjectreliabilityen_US
dc.titleCharacterization of polysilicon thin-film transistors with asymmetric source/drain implantationen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.nimb.2005.04.104en_US
dc.identifier.journalNUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMSen_US
dc.citation.volume237en_US
dc.citation.issue1-2en_US
dc.citation.spage223en_US
dc.citation.epage227en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000231543000043-
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