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dc.contributor.authorTang, Chun-Jungen_US
dc.contributor.authorHuang, Shih-Hianen_US
dc.contributor.authorWang, Tahuien_US
dc.contributor.authorChang, Chih-Shengen_US
dc.date.accessioned2017-04-21T06:49:43Z-
dc.date.available2017-04-21T06:49:43Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-0584-8en_US
dc.identifier.urihttp://hdl.handle.net/11536/134459-
dc.description.abstractThis paper performed a detail study on the strained PMOS fabricated on the (I 10) Si substrate. We showed that in the (I 10) plane, the four-fold symmetry direction, <111(,)>, has the ideal band-structure features for the uniaxial-process-induced hole mobility enhancement. We then characterized the mobility and back scattering ratio of the (110)/<111(,)> PMOS with multiple process induced stressors.en_US
dc.language.isoen_USen_US
dc.titleInvestigation of the strained PMOS on (110) substrateen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERSen_US
dc.citation.spage82en_US
dc.citation.epage+en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000247059300037en_US
dc.citation.woscount0en_US
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