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dc.contributor.authorChen, Yang Chuanen_US
dc.contributor.authorLi, Chun-Hsingen_US
dc.contributor.authorHuang, J. K.en_US
dc.contributor.authorKuo, Chien-Nanen_US
dc.contributor.authorCheng, Yu Tingen_US
dc.date.accessioned2017-04-21T06:49:46Z-
dc.date.available2017-04-21T06:49:46Z-
dc.date.issued2006en_US
dc.identifier.isbn978-1-4244-0394-3en_US
dc.identifier.urihttp://dx.doi.org/10.1109/ICECS.2006.379966en_US
dc.identifier.urihttp://hdl.handle.net/11536/134471-
dc.description.abstractIn this paper we present a tunable ultra-wideband LNA using system-in-package solution to enhance gain and noise performance. Several high-Q MEMS inductors are employed at the input matching network and the tunable resonator load. SiP integration is realized by Au-Au thermal compression bond of low electrical parasitic effects. It is found those inductors improve noise figure by 2dB and help achieve gain flatness in a broad frequency range of 3- to 8-GRz.en_US
dc.language.isoen_USen_US
dc.titleLow power 3 similar to 8-GHz UWB tunable LNA design using SiP technologyen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/ICECS.2006.379966en_US
dc.identifier.journal2006 13TH IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS AND SYSTEMS, VOLS 1-3en_US
dc.citation.spage1026en_US
dc.citation.epage+en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000252489600256en_US
dc.citation.woscount0en_US
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