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dc.contributor.authorChen, Yu-Shengen_US
dc.contributor.authorWu, Tai-Yuanen_US
dc.contributor.authorTzeng, Pei-Jeren_US
dc.contributor.authorChen, Pang-Shiuen_US
dc.contributor.authorLee, Heng-Yuanen_US
dc.contributor.authorLin, Cha-Hsinen_US
dc.contributor.authorChen, Fredericken_US
dc.contributor.authorTsai, Ming-Jinnen_US
dc.date.accessioned2017-04-21T06:49:32Z-
dc.date.available2017-04-21T06:49:32Z-
dc.date.issued2009en_US
dc.identifier.isbn978-1-4244-2784-0en_US
dc.identifier.urihttp://dx.doi.org/10.1109/VTSA.2009.5159281en_US
dc.identifier.urihttp://hdl.handle.net/11536/135007-
dc.language.isoen_USen_US
dc.titleForming-free HfO2 Bipolar RRAM Device with Improved Endurance and High Speed Operationen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/VTSA.2009.5159281en_US
dc.identifier.journalPROCEEDINGS OF TECHNICAL PROGRAM: 2009 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONSen_US
dc.citation.spage37en_US
dc.citation.epage+en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000272451000016en_US
dc.citation.woscount8en_US
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