Effects of width scaling, length scaling, and layout variation on electromigrationin in dual damascene copper interconnects

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Lin, M. H.	en_US
dc.contributor.author	Chang, K. P.	en_US
dc.contributor.author	Su, K. C.	en_US
dc.contributor.author	Wang, Tahui	en_US
dc.date.accessioned	2017-04-21T06:48:16Z	-
dc.date.available	2017-04-21T06:48:16Z	-
dc.date.issued	2006	en_US
dc.identifier.isbn	0-7803-9498-4	en_US
dc.identifier.issn	1541-7026	en_US
dc.identifier.uri	http://dx.doi.org/10.1109/RELPHY.2006.251317	en_US
dc.identifier.uri	http://hdl.handle.net/11536/135206	-
dc.language.iso	en_US	en_US
dc.title	Effects of width scaling, length scaling, and layout variation on electromigrationin in dual damascene copper interconnects	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.doi	10.1109/RELPHY.2006.251317	en_US
dc.identifier.journal	2006 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 44TH ANNUAL	en_US
dc.citation.spage	671	en_US
dc.citation.epage	+	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:000240855800132	en_US
dc.citation.woscount	2	en_US
顯示於類別：	會議論文