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dc.contributor.authorYu, Beien_US
dc.contributor.authorLin, Yen-Hungen_US
dc.contributor.authorLuk-Pat, Gerarden_US
dc.contributor.authorDing, Duoen_US
dc.contributor.authorLucas, Kevinen_US
dc.contributor.authorPan, David Z.en_US
dc.date.accessioned2017-04-21T06:50:06Z-
dc.date.available2017-04-21T06:50:06Z-
dc.date.issued2013en_US
dc.identifier.isbn978-1-4799-1071-7en_US
dc.identifier.issn1933-7760en_US
dc.identifier.urihttp://hdl.handle.net/11536/135398-
dc.description.abstractTriple patterning lithography (TPL) has received more and more attentions from industry as one of the leading candidate for 14nm/11nm nodes. In this paper, we propose a high performance layout decomposer for TPL. Density balancing is seamlessly integrated into all key steps in our TPL layout decomposition, including density-balanced semi-definite programming (SDP), density-based mapping, and density-balanced graph simplification. Our new TPL decomposer can obtain high performance even compared to previous state-of-the-art layout decomposers which are not balanced-density aware, e. g., by Yu et al. (ICCAD\'11), Fang et al. (DAC\'12), and Kuang et al. (DAC\'13). Furthermore, the balanced-density version of our decomposer can provide more balanced density which leads to less edge placement error (EPE), while the conflict and stitch numbers are still very comparable to our non-balanced-density baseline.en_US
dc.language.isoen_USen_US
dc.titleA High-Performance Triple Patterning Layout Decomposer with Balanced Densityen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2013 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD)en_US
dc.citation.spage163en_US
dc.citation.epage169en_US
dc.contributor.department資訊工程學系zh_TW
dc.contributor.departmentDepartment of Computer Scienceen_US
dc.identifier.wosnumberWOS:000331072100025en_US
dc.citation.woscount19en_US
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