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dc.contributor.authorKer, MDen_US
dc.contributor.authorWu, CYen_US
dc.contributor.authorChang, HHen_US
dc.date.accessioned2014-12-08T15:02:44Z-
dc.date.available2014-12-08T15:02:44Z-
dc.date.issued1996-04-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://hdl.handle.net/11536/1358-
dc.description.abstractThere are one LVTSCR device merged with short-channel NMOS and another LVTSCR device merged with short-channel PMOS in complementary style to offer effective and direct ESD discharging paths from the input or output pads to VSS and VDD power lines, The trigger voltages of LVTSCR devices are lowered to the snapback-breakdown voltages of short-channel NMOS and PMOS devices. This complementary-LVTSCR ESD protection circuit offers four different discharging paths to one-by-one bypass the four modes of ESD stresses at the pad, so it can effectively avoid the unexpected ESD damages on internal circuits, Experimental results show that it can perform excellent ESD protection capability in a smaller layout area as compared to the conventional CMOS ESD protection circuit, The device characteristics under high-temperature environment of up to 150 degrees C is also experimentally investigated to guarantee the safety of this proposed ESD protection circuit.en_US
dc.language.isoen_USen_US
dc.titleComplementary-LVTSCR ESD protection circuit for submicron CMOS VLSI/ULSIen_US
dc.typeArticleen_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume43en_US
dc.citation.issue4en_US
dc.citation.spage588en_US
dc.citation.epage598en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1996UC51100012-
dc.citation.woscount32-
Appears in Collections:Articles


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