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dc.contributor.authorLiao, Seian-Fengen_US
dc.contributor.authorTang, Kai-Nengen_US
dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorYeh, Jia-Rongen_US
dc.contributor.authorChiou, Hwa-Chyien_US
dc.contributor.authorHuang, Yeh-Jenen_US
dc.contributor.authorTsai, Chun-Chienen_US
dc.contributor.authorJou, Yeh-Ningen_US
dc.contributor.authorLin, Geeng-Lihen_US
dc.date.accessioned2017-04-21T06:49:05Z-
dc.date.available2017-04-21T06:49:05Z-
dc.date.issued2015en_US
dc.identifier.isbn978-1-4799-9877-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/135942-
dc.description.abstractElectrostatic discharge (ESD) protection and latchup prevention are two important reliability issues to the CMOS integrated circuits, especially in high-voltage (HV) applications. In this work, the stacked low-voltage (LV) PMOS devices have been successfully verified in a 0.5-mu m HV process to provide high ESD level with high holding voltage for HV applications. In addition, the guard-ring layout on the stacked LV PMOS devices was further investigated in silicon chip to get high ESD robustness and latchup-free immunity for HV applications.en_US
dc.language.isoen_USen_US
dc.titleImpact of Guard Ring Layout on the Stacked Low-Voltage PMOS for High-Voltage ESD Protectionen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2015 EUROPEAN CONFERENCE ON CIRCUIT THEORY AND DESIGN (ECCTD)en_US
dc.citation.spage185en_US
dc.citation.epage188en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000380498200090en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper