Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Huang, Shih-Chieh | en_US |
dc.contributor.author | Lu, Shao-Yung | en_US |
dc.contributor.author | Cheng, Fu-Yuan | en_US |
dc.contributor.author | Tsai, Tsung-Heng | en_US |
dc.contributor.author | Liao, Yu-Te | en_US |
dc.date.accessioned | 2017-04-21T06:49:17Z | - |
dc.date.available | 2017-04-21T06:49:17Z | - |
dc.date.issued | 2015 | en_US |
dc.identifier.isbn | 978-1-4799-8203-5 | en_US |
dc.identifier.issn | 1930-0395 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/135966 | - |
dc.description.abstract | This paper presents the design and implementation of a fully-integrated CMOS accelerometer using bondwires as sensing devices without Micro Electro-Mechanical Systems (MEMS) processes. The model and analysis of bondwire inertial sensors are provided for further implementation of low-power and low-noise accelerometers. Finite element method (FEM) simulation is performed to verify the concept and model. This paper also proposes a closed-loop readout interface that suppresses the in-band noise and reduces both design complexity and power consumption. The bondwire accelerometer is fabricated in a 0.18 mu m CMOS process, achieves a 33 mV/g linear transducer gain within a 5 kHz bandwidth, and consumes 9 mW. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Bondwire | en_US |
dc.subject | Accelerometer | en_US |
dc.subject | Inertial sensor | en_US |
dc.subject | CMOS integration | en_US |
dc.title | A Low-Power Wireless Bondwire Inertial Sensor System | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2015 IEEE SENSORS | en_US |
dc.citation.spage | 470 | en_US |
dc.citation.epage | 473 | en_US |
dc.contributor.department | 電機學院 | zh_TW |
dc.contributor.department | College of Electrical and Computer Engineering | en_US |
dc.identifier.wosnumber | WOS:000380440800122 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Conferences Paper |