Title: A Low-Power Wireless Bondwire Inertial Sensor System
Authors: Huang, Shih-Chieh
Lu, Shao-Yung
Cheng, Fu-Yuan
Tsai, Tsung-Heng
Liao, Yu-Te
電機學院
College of Electrical and Computer Engineering
Keywords: Bondwire;Accelerometer;Inertial sensor;CMOS integration
Issue Date: 2015
Abstract: This paper presents the design and implementation of a fully-integrated CMOS accelerometer using bondwires as sensing devices without Micro Electro-Mechanical Systems (MEMS) processes. The model and analysis of bondwire inertial sensors are provided for further implementation of low-power and low-noise accelerometers. Finite element method (FEM) simulation is performed to verify the concept and model. This paper also proposes a closed-loop readout interface that suppresses the in-band noise and reduces both design complexity and power consumption. The bondwire accelerometer is fabricated in a 0.18 mu m CMOS process, achieves a 33 mV/g linear transducer gain within a 5 kHz bandwidth, and consumes 9 mW.
URI: http://hdl.handle.net/11536/135966
ISBN: 978-1-4799-8203-5
ISSN: 1930-0395
Journal: 2015 IEEE SENSORS
Begin Page: 470
End Page: 473
Appears in Collections:Conferences Paper