Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder Diameters

標題:	Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder Diameters
作者:	Hsieh, Wan-Lin Lin, Chung-Kuang Zhan, Chau-Jie Huang, Yu-wei Chen, Chih 交大名義發表材料科學與工程學系 National Chiao Tung University Department of Materials Science and Engineering
公開日期:	2015
摘要:	Theoretical calculation and simulation of FEM were proposed to explain the decline of change in resistance in Cu-Sn microbumps during the electromigration test. The IMC transformation from Cu6Sn5 to Cu3Sn was supposed to be the reason. Being aware that the dimension keeps shrinking, the behavior for various solder diameters was also investigated.
URI:	http://hdl.handle.net/11536/136103
ISBN:	978-1-4799-9928-6
ISSN:	1946-1550
期刊:	PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015)
起始頁:	362
結束頁:	365
Appears in Collections:	Conferences Paper