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dc.contributor.authorWang, Shin-Yuanen_US
dc.contributor.authorChien, Chao-Hsinen_US
dc.contributor.authorLin, Jin-Juen_US
dc.contributor.authorChang, Chun-Yenen_US
dc.date.accessioned2017-04-21T06:49:47Z-
dc.date.available2017-04-21T06:49:47Z-
dc.date.issued2015en_US
dc.identifier.isbn978-1-4799-9928-6en_US
dc.identifier.issn1946-1550en_US
dc.identifier.urihttp://hdl.handle.net/11536/136106-
dc.description.abstractN-type InGaAs MOSFETs with self-aligned nickel-InGaAs alloy and ex-situ ALD Al2O3 as gate dielectrics was successfully fabricated. The InGaAs MOSFETs exhibit an S/D resistance (RSD) that is lower than that in P-N junction devices due to the low Schottky barrier height and the peak mobility was about 1138 cm(2)/V-s and the interface state density (D-it) was about 10(12) cm(-2)eV(-1) at ET = EV + 0.6 eV by using full-conductance methoden_US
dc.language.isoen_USen_US
dc.titleInGaAs Metal-Oxide-Semiconductor FETs with Self-Aligned Ni-Alloy Source/Drainen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015)en_US
dc.citation.spage390en_US
dc.citation.epage393en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000380466200099en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper