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dc.contributor.authorChou, Kun-Ien_US
dc.contributor.authorCheng, Chun-Huen_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2017-04-21T06:50:00Z-
dc.date.available2017-04-21T06:50:00Z-
dc.date.issued2013en_US
dc.identifier.isbn978-1-4673-2523-3en_US
dc.identifier.urihttp://hdl.handle.net/11536/136157-
dc.description.abstractWe report a resistive random-access memory (RRAM) using stacked GeO2 and PZT. Under unipolar mode operation, the Ni/GeO2/PZT/TaN RRAM shows a good DC cycling of 2x10(3) cycles, 85 degrees C retention, and large resistance window about 120x, which is better than that shown by the single-layer Ni/PZT/TaN RRAM without the covalent-bond-dielectric GeO2.en_US
dc.language.isoen_USen_US
dc.subjectRRAMen_US
dc.subjectGeO2en_US
dc.subjectTiO2en_US
dc.subjectPZTen_US
dc.titleGeO2/PZT Resistive Random Access Memory Devices With Ni electrodeen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2013 IEEE INTERNATIONAL CONFERENCE OF ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000380585600164en_US
dc.citation.woscount0en_US
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