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dc.contributor.authorSchlichtmann, Ulfen_US
dc.contributor.authorHashimoto, Masanorien_US
dc.contributor.authorJiang, Iris Hui-Ruen_US
dc.contributor.authorLi, Bingen_US
dc.date.accessioned2017-04-21T06:49:52Z-
dc.date.available2017-04-21T06:49:52Z-
dc.date.issued2016en_US
dc.identifier.isbn978-1-4673-9569-4en_US
dc.identifier.issn2153-6961en_US
dc.identifier.urihttp://hdl.handle.net/11536/136178-
dc.description.abstractAt nanometer manufacturing technology nodes, process variations affect circuit performance significantly. In addition, performance deterioration of circuits due to aging effects is also increasing. Consequently, a large timing margin is required to maintain yield. To combat the pessimism and the resulting overdesign, aging analysis with high-level models, on-chip timing margin monitoring and tuning, and flexible delay models of flip-flops can be deployed. This paper gives an overview of the state of the art of applying these techniques to improve the health of circuits.en_US
dc.language.isoen_USen_US
dc.titleReliability, Adaptability and Flexibility in Timing: Buy a Life Insurance for Your Circuitsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2016 21ST ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC)en_US
dc.citation.spage705en_US
dc.citation.epage711en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000384642200122en_US
dc.citation.woscount0en_US
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