完整後設資料紀錄
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dc.contributor.authorLee, Shih-Weien_US
dc.contributor.authorShih, Jian-Yuen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.contributor.authorHwang, Weien_US
dc.contributor.authorChiou, Jin-Chernen_US
dc.contributor.authorChen, Kuo-Huaen_US
dc.contributor.authorChiu, Chi-Tsungen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2017-04-21T06:48:57Z-
dc.date.available2017-04-21T06:48:57Z-
dc.date.issued2014en_US
dc.identifier.isbn978-1-4799-7727-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/136337-
dc.description.abstractIn this research, a novel process scheme for polymer TSV fabrication is proposed to solve the difficulty of polymer liner formation in TSV technology. The corresponding structure shows great manufacturability to replace traditional fabrication approach. In addition, Kelvin structure of the daisy chain is designed for evaluating electrical performance and reliability. Moreover, daisy chain with dummy TSV is designed to verify the impact of TSV pitch on TSV fabrication by using electrical measurement. The reliability tests include thermal cycling and humidity test to verify the quality of proposed polymer TSV design. Finally, a void-free polymer TSV with uniform liner formation is successfully fabricated and demonstrated.en_US
dc.language.isoen_USen_US
dc.titlePolymer TSV Fabrication Scheme with Its Electrical and Reliability Test Vehicleen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)en_US
dc.citation.spage282en_US
dc.citation.epage285en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000380572700064en_US
dc.citation.woscount0en_US
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