Full metadata record
DC FieldValueLanguage
dc.contributor.authorCheng, Ya-Chien_US
dc.contributor.authorChen, Hung-Binen_US
dc.contributor.authorShao, Chi-Shenen_US
dc.contributor.authorSu, Jun-Jien_US
dc.contributor.authorWu, Yung-Chunen_US
dc.contributor.authorChang, Chun-Yenen_US
dc.contributor.authorChang, Ting-Changen_US
dc.date.accessioned2017-04-21T06:49:14Z-
dc.date.available2017-04-21T06:49:14Z-
dc.date.issued2014en_US
dc.identifier.isbn978-1-4799-8000-0en_US
dc.identifier.urihttp://hdl.handle.net/11536/136351-
dc.description.abstractThe hybrid poly-Si fin channel junctionless (JL) field-effect transistors (FET) are fabricated first. This novel devices show stable temperature/reliability characteristics, and excellent electrical performances in terms of a steep SS (64mV/dec), a high I-on/I-off current ratio (>10(7)) and a small DIBL (3mV/V) by reducing the effective channel thickness that is caused by the hybrid P+ channel and n-type substrate (hybrid P/N) junction. In addition, the novel P/N JL-TFT shows smaller series resistance and less current crowding than convectional JL-TFT with ultra-thin channel. Furthermore, our device can be supported by simulated results using technology computer-aided design (TCAD) simulation. Hence, the proposed hybrid P/N JL-TFTs are highly promising for future further scaling.en_US
dc.language.isoen_USen_US
dc.titlePerformance Enhancement of a Novel P-type Junctionless Transistor Using a Hybrid Poly-Si Fin Channelen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000370384800154en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper