標題: | Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D Integration |
作者: | Liang, Hao-Wen Yu, Ting-Yang Chang, Yao-Jen Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 2016 |
摘要: | Wafer-level Sn/In-Cu bonding structure with Ni ultra-thin buffer layer is investigated to achieve a reduction in solder thickness, bonding temperature and duration. Furthermore, the asymmetric bonding structure is able to separate the manufacturing process of solder and electrical isolation layer. It is a promising approach for the application on hybrid bonding of three-dimensional integration. |
URI: | http://hdl.handle.net/11536/136413 |
ISBN: | 978-1-4673-8258-8 |
ISSN: | 1946-1550 |
期刊: | Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
起始頁: | 312 |
結束頁: | 315 |
Appears in Collections: | Conferences Paper |