標題: Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D Integration
作者: Liang, Hao-Wen
Yu, Ting-Yang
Chang, Yao-Jen
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 2016
摘要: Wafer-level Sn/In-Cu bonding structure with Ni ultra-thin buffer layer is investigated to achieve a reduction in solder thickness, bonding temperature and duration. Furthermore, the asymmetric bonding structure is able to separate the manufacturing process of solder and electrical isolation layer. It is a promising approach for the application on hybrid bonding of three-dimensional integration.
URI: http://hdl.handle.net/11536/136413
ISBN: 978-1-4673-8258-8
ISSN: 1946-1550
期刊: Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
起始頁: 312
結束頁: 315
Appears in Collections:Conferences Paper