Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices

Title:	Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
Authors:	Chen, Chih Liu, Chien-Min Lu, Tien-Lin Lin, Han-wen Chu, Yi-Cheng Lu, Chia-Ling Juang, Jing-Ye Chen, Kuan-Neng Tu, K. N. 材料科學與工程學系電子工程學系及電子研究所 Department of Materials Science and Engineering Department of Electronics Engineering and Institute of Electronics
Issue Date:	2016
URI:	http://hdl.handle.net/11536/136457
ISBN:	978-1-5090-0386-0
Journal:	2016 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC)
Begin Page:	27
End Page:	27
Appears in Collections:	Conferences Paper