標題: 砷化鎵薄膜混合式太陽能電池以及晶圓級的矽混合式太陽能電池
Wafer-bonded PEDOT:PSS/GaAs thin-film hybrid solar cells and Wafer-scale PEDOT:PSS/Si hybrid solar cells
作者: 鄭傑文
孫建文
Cheng, Chieh-wen
應用化學系碩博士班
關鍵字: 大面積;砷化鎵;混合式太陽能電池;薄膜;晶圓接合;wafer-scale;GaAs;hybrid solar cells;PEDOT:PSS;wafer bonding;thin film
公開日期: 2015
摘要:   近年來,混合式太陽能電池的發展,結合無機材料和有機高分子太陽能電池的優點,其優勢在於使用簡單和低溫製程的方式製作元件,可降低成本。本論文分為兩個部分,第一部分,利用薄膜的砷化鎵做成混合式太陽能電池,第二部分,將整個4吋矽晶圓製作成混合式太陽能電池。 (1) 我們製作厚度約為1.2 μm的砷化鎵薄膜,用晶圓接合技術,接合在矽晶圓上,並使用濕式蝕刻的方式蝕刻Al0.3Ga0.7As,找出最佳厚度,將Al0.3Ga0.7As當作表面電場,並塗佈上PEDOT:PSS效率達8.93 %,但發現在晶圓接合時,會有金屬進入到薄膜,造成效率未達預期。 (2) 在過去普遍學者製作出的PEDOT:PSS/Si的元件面積,多為2*2 cm2,而我們將使用界面活性劑DuPont Capstone FS-31添加進PEDOT:PSS當中,並使用4吋矽晶圓直接製做成矽混合式太陽能電池,其效率達10.25%,將太陽能電池的面積做大的優點為,可以使製程時間縮短,以及不用擔心破片時帶來的汙染,這樣在未來商業化時都是有利於降低成本的。
In recent years, development of hybrid solar cells which combines the advantages from inorganic materials and organic solar cells provides a simple, low temperature process to fabricate solar cell devices with reduced cost. Content of this thesis work was divided into two parts. In the first part, we demonstrated a PEDOT:PSS on GaAs thin film hybrid solar cells by using wafer bonding and chemical wet etching techniques. The thin film hybrid solar cells reached an excellent power conversion efficiency efficiency of 8.93% when an additional p+ Al0.3Ga0.7As epi-layer is deposited on the surface of the solar cells to provide a front-surface field. However, we uncovered that the bonding materials was able to diffuse into the GaAs thin film during the wafer-bonding stage, which led to the decrease in efficiency. In the second part of the thesis, we demonstrated an 4 inch PEDOT:PSS/silicon hybrid solar cell device by adding the DuPont Capstone FS-31 surfactant into the spin-coated PEDOT:PSS layer. Effects of the non-uniformity of the PEDOT:PSS layer on cell performance was investigated. The device achieved an overall conversion efficiency of 10.25% and a total output current and voltage of 26.23 mA/cm2 and 0.46 V, respectively. The as-made large-area solar cells benefits from the reduction in the fabrication time and cost, and particularly in preventing the pollution from the wafer-cutting.
URI: http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070252559
http://hdl.handle.net/11536/138474
顯示於類別:畢業論文