标题: | 砷化镓薄膜混合式太阳能电池以及晶圆级的矽混合式太阳能电池 Wafer-bonded PEDOT:PSS/GaAs thin-film hybrid solar cells and Wafer-scale PEDOT:PSS/Si hybrid solar cells |
作者: | 郑杰文 孙建文 Cheng, Chieh-wen 应用化学系硕博士班 |
关键字: | 大面积;砷化镓;混合式太阳能电池;薄膜;晶圆接合;wafer-scale;GaAs;hybrid solar cells;PEDOT:PSS;wafer bonding;thin film |
公开日期: | 2015 |
摘要: | 近年来,混合式太阳能电池的发展,结合无机材料和有机高分子太阳能电池的优点,其优势在于使用简单和低温制程的方式制作元件,可降低成本。本论文分为两个部分,第一部分,利用薄膜的砷化镓做成混合式太阳能电池,第二部分,将整个4寸矽晶圆制作成混合式太阳能电池。 (1) 我们制作厚度约为1.2 μm的砷化镓薄膜,用晶圆接合技术,接合在矽晶圆上,并使用湿式蚀刻的方式蚀刻Al0.3Ga0.7As,找出最佳厚度,将Al0.3Ga0.7As当作表面电场,并涂布上PEDOT:PSS效率达8.93 %,但发现在晶圆接合时,会有金属进入到薄膜,造成效率未达预期。 (2) 在过去普遍学者制作出的PEDOT:PSS/Si的元件面积,多为2*2 cm2,而我们将使用界面活性剂DuPont Capstone FS-31添加进PEDOT:PSS当中,并使用4寸矽晶圆直接制做成矽混合式太阳能电池,其效率达10.25%,将太阳能电池的面积做大的优点为,可以使制程时间缩短,以及不用担心破片时带来的污染,这样在未来商业化时都是有利于降低成本的。 In recent years, development of hybrid solar cells which combines the advantages from inorganic materials and organic solar cells provides a simple, low temperature process to fabricate solar cell devices with reduced cost. Content of this thesis work was divided into two parts. In the first part, we demonstrated a PEDOT:PSS on GaAs thin film hybrid solar cells by using wafer bonding and chemical wet etching techniques. The thin film hybrid solar cells reached an excellent power conversion efficiency efficiency of 8.93% when an additional p+ Al0.3Ga0.7As epi-layer is deposited on the surface of the solar cells to provide a front-surface field. However, we uncovered that the bonding materials was able to diffuse into the GaAs thin film during the wafer-bonding stage, which led to the decrease in efficiency. In the second part of the thesis, we demonstrated an 4 inch PEDOT:PSS/silicon hybrid solar cell device by adding the DuPont Capstone FS-31 surfactant into the spin-coated PEDOT:PSS layer. Effects of the non-uniformity of the PEDOT:PSS layer on cell performance was investigated. The device achieved an overall conversion efficiency of 10.25% and a total output current and voltage of 26.23 mA/cm2 and 0.46 V, respectively. The as-made large-area solar cells benefits from the reduction in the fabrication time and cost, and particularly in preventing the pollution from the wafer-cutting. |
URI: | http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070252559 http://hdl.handle.net/11536/138474 |
显示于类别: | Thesis |