完整後設資料紀錄
DC 欄位語言
dc.contributor.author江宜潔zh_TW
dc.contributor.author唐麗英zh_TW
dc.contributor.author洪瑞雲zh_TW
dc.contributor.authorChiang, Yi-Chiehen_US
dc.contributor.authorTong, Lee-Ingen_US
dc.contributor.authorHorng, Ruey-Yunen_US
dc.date.accessioned2018-01-24T07:38:02Z-
dc.date.available2018-01-24T07:38:02Z-
dc.date.issued2016en_US
dc.identifier.urihttp://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070363322en_US
dc.identifier.urihttp://hdl.handle.net/11536/139466-
dc.description.abstract本研究主要目的是針對TFT-LCD製造過程中,Array段的薄膜製程(Thin Film Process)中第二道的CVD製程進行最佳化。本研究首先藉由田口方法(Taguchi Method)來釐清CVD製程中重要參數的變動與TFT的電性變化間之關聯性以找出影響電性均勻度的顯著參數,再利用反應曲面法(Response Surface Method, RSM)找出使CVD成膜均勻性最佳的參數設定值。本研究最後利用台灣某LCD廠商的一個實例,以Array的良率及電性均勻度(Electric characteristic uniformity)來確認本研究所找出之CVD成膜參數設定值確實有效。zh_TW
dc.description.abstractThe main objective of this study is to improving the uniformity of the electric characteristic of CVD Process, which is the second thin film Process of Array in manufacturing TFT-LCD. The Taguchi method is utilized to clarify the relation between process Parameters and the electric characteristic of TFT and to find out the significant parameters of the CVD process. Then the optimal setting of these significant parameters are determined using Response Surface Method (RSM). Finally, a real case is utilized to verify the effectiveness of the proposed procedure for finding the optimal parameters setting to maximize the yield and enhance the electric characteristic.en_US
dc.language.isozh_TWen_US
dc.subject薄膜電晶體陣列製程zh_TW
dc.subject電漿輔助化學氣相沉積zh_TW
dc.subject良率zh_TW
dc.subject電性均勻度zh_TW
dc.subject田口方法zh_TW
dc.subject反應曲面法zh_TW
dc.subjectTFT Array Processen_US
dc.subjectPlasma Enhanced Vapor Deposition (PECVD)en_US
dc.subjectYielden_US
dc.subjectElectric characteristic uniformityen_US
dc.subjectTaguchi Methoden_US
dc.subjectResponse Surface Method(RSM)en_US
dc.title形成TFT結構之CVD成膜最佳電性均勻度的參數設定zh_TW
dc.titleThe Optimal Parameter Setting for Improving the Uniformity of the Electric Characteristic of the CVD Process for Forming the TFT Structureen_US
dc.typeThesisen_US
dc.contributor.department管理學院工業工程與管理學程zh_TW
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