标题: 球栅阵列封装布局与打线讯号干扰效应最佳化研究
A Study of the Effect of BGA Layout on Signal Interference and Bond Wire Optimization
作者: 彭建华
吴霖堃
Peng, Jian-Hua
Wu, Lin-Kun
电机学院电信学程
关键字: 球栅阵列封装;打线;Ball Grid Array;BGA;Bond Wire
公开日期: 2016
摘要: 本篇论文以智慧电视(Smart TV)为实验平台,研究主画面正常播放影片时语音类比转数位(Audio ADC)的输入被背景收台并在同一个画面输出( Picture-in- Picture,PIP )之类比电视信号(ATV)Audio DAC接地电流回流透过共同之下地贯孔造成干扰的问题。将Audio DAC的非同步频差电流藉由增加接地贯孔降低等效阻抗可降低感应电压变化。此外,透过分离Audio ADC接地路径,避开共用路径与降低互感,也可使DAC差频电流产生的影响降到最低,才不会被Audio DAC取样杂讯干扰,这些做法可以有效减少Audio DAC电流噪音而降低开关杂讯干扰。
本论文利用ANSOFT HFSS商业软体模拟分析,模拟改善接地贯孔路径以降低球栅阵列结构印刷电路板(Ball Grid Array ,BGA)之间相互的干扰。实验结果显示,改善电流回流贯孔路径的做法在Audio ADC模组内的干扰问题上面,可获得16-dB的改善效果。
This thesis uses smart TV as the experimental platform to study the interference originating from audio DAC (digital-to-analog converter) ground return currents to audio ADC (analog-to-digital converter) ground through the same return path when the TV operates in the PIP (Picture-in-Picture) mode in witch both the main screen and the background analog TV play video and voice. Increasing the number of vias used for the audio DAC’s non-synchronous frequency-differential currents and go to the ground directly, will reduce the path’s impedance and the induced voltage changes. In addition, separating Audio ADC’s ground path to avoid the common current path and reducing mutual inductance can also minimize the impact of the DAC difference-frequency currents and avoiding interference from Audio DAC sampling noise. These practices can effectively reduce audible noise due to audio DAC noise and switching noise.
In this thesis, we also use ANSOFT HFSS to do simulation. Simulation results indicate that improving the ground and power path return current reduces mutual interference. After improving the current return path in the BGA package, experiment as measurements show that the interference level found in the audio ADC module is significantly reduced by 16 dB.
URI: http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070260710
http://hdl.handle.net/11536/140095
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