標題: 台灣半導體設備商公司治理策略研究-3D IC封裝技術/IC載板設備商
Corporate Governance Strategy of Taiwan Semiconductor Equipment Suppliers-3DIC Packaging technology / IC carrier equipment supplier
作者: 王彥智
葉銀華
Wang,Yen-Chih
Yeh,Yin-Hua
管理學院高階主管管理碩士學程
關鍵字: 半導體設備商;3D IC先進封裝;資本支出;公司治理;Semiconductor Equipment Vendor;3D IC Advanced Package;Capital Expenditure;Corporate Goverance
公開日期: 2016
URI: http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070363034
http://hdl.handle.net/11536/140290
Appears in Collections:Thesis