LED封裝段之點膠製程最佳化

Abstract

在LED製造過程中，封裝段的點膠製程(Dispensing Process)所使用的螢光粉占了材料成本極高的比重，且螢光粉也是影響LED顏色及亮度的最關鍵的因素，因此點膠製程可說是決定LED封裝段中決定獲利與否最關鍵的製程。為了改善LED產出的CIE集中度(國際照明委員會International Commission on Illumination)以及降低不符合CIE規範的產出，本研究之主要目的是先利用田口方法，篩選出影響點膠製程的重要因子，再利用反應曲面設計找出這些重要因子之最佳設定值，以有效提升點膠製程的良率。本論文最後以台灣某光電廠提供之LED封裝段的點膠製程的實際資料，驗證了本研究方法確實可以有效提升點膠製程良率。

In the LED manufacturing process, the dispensing process is the most important process of LED package. Phosphor material used in dispensing process not only accounts for a large portion of total cost, but also affects the color and brightness of LED products. The color and brightness of LED products are two key factors of LED quality. In order to improve the commission internationale de l´eclairage (CIE) , this study utilized Taguchi's method to selection the important factors and then the response surface method is employed to determine the optimal parameter level setting for those factors. Finally, a real case from a Taiwanese LED manufacturer is demonstrated to verify the effectiveness of the proposed method.