有機垂直式電晶體耐壓與整合研究

Title:	有機垂直式電晶體耐壓與整合研究 Integration process and voltage endurance of vertical organic transistor
Authors:	彭少甫冉曉雯蔡娟娟 Peng, Shao-Fu Zan, Hsiao-Wen Tsai, Chuang-Chuang 光電工程研究所
Keywords:	空間電荷限制電晶體;耐壓;基極絕緣包覆;錫球接合;雙層絕緣層PVP;SCLT;Voltage Endurance;Base Coverage;Tin Balls Soldering;Double PVP Layers
Issue Date:	2016
URI:	http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070250574 http://hdl.handle.net/11536/143182
Appears in Collections:	Thesis

APA	彭., 冉., 蔡., Peng, S., Zan, H., & Tsai, C. (2016). 有機垂直式電晶體耐壓與整合研究. http://hdl.handle.net/11536/143182.
Bibtex	@article{彭少甫 and 冉曉雯 and 蔡娟娟 and Peng2016, title={有機垂直式電晶體耐壓與整合研究}, author={彭少甫 and 冉曉雯 and 蔡娟娟 and Peng, Shao-Fu and Zan, Hsiao-Wen and Tsai, Chuang-Chuang}, journal={http://hdl.handle.net/11536/143182}, year={2016}, url={https://ir.lib.nycu.edu.tw/handle/11536/143182}, }