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dc.contributor.authorTseng, Ming-Chunen_US
dc.contributor.authorWuu, Dong-Singen_US
dc.contributor.authorChen, Chi-Luen_US
dc.contributor.authorLee, Hsin-Yingen_US
dc.contributor.authorHorng, Ray-Huaen_US
dc.date.accessioned2018-08-21T05:53:01Z-
dc.date.available2018-08-21T05:53:01Z-
dc.date.issued2018-02-28en_US
dc.identifier.issn0169-4332en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.apsusc.2017.06.106en_US
dc.identifier.urihttp://hdl.handle.net/11536/144174-
dc.description.abstractTransparent conductive layers deposited on a GaP window layer were used to fabricate high-brightness p-side-up thin-film AlGaInP light emitting diodes (LEDs). Zinc oxide (ZnO) and aluminum-doped zinc oxide (ZAO) with an Zn:Al cycle ratio of 20:1 were grown by atomic layer deposition for comparison. The ZAO thin films reduced the droop in the external quantum efficiencies of the LEDs as well as the junction temperature, which result in increases in the light output power and thermal stability of the LEDs. The efficiency droops of the LEDs with the ZnO and ZAO thin films were 41% and 15%, respectively. The junction temperature of the LED with the ZAO thin film can be reduced to 39.6 degrees C at an injection current of 700 mA, which is lower than that of the LED with the ZnO thin film (58.1 degrees C). The above results are promising for the development of ZAO thin films for applications in AlGaInP LEDs. (C) 2017 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectp-Side-up thin-film LEDen_US
dc.subjectCurrent spreading layeren_US
dc.subjectAluminum-doped zinc oxideen_US
dc.titleZinc oxide-based current spreading layer behavior on the performance of P-side-up thin-film red light emitting diodesen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.apsusc.2017.06.106en_US
dc.identifier.journalAPPLIED SURFACE SCIENCEen_US
dc.citation.volume432en_US
dc.citation.spage196en_US
dc.citation.epage201en_US
dc.contributor.department電機學院zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000416967800021en_US
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