標題: Nanomechanical properties of Ag solder bumps doped with Pd and Au
作者: Wen, Hua-Chiang
Chou, Wu-Ching
Lin, Shiuan Huei
Jiang, Don Son
電子物理學系
Department of Electrophysics
關鍵字: Ag solder;Thermal treatment;Nanoindentation;Hardness;Creep;Strength
公開日期: 1-Dec-2017
摘要: As an approach to increasing their reliability, we doped Ag solder bumps with Pd and Au alloys to enhance their creep resistance, which we characterized using a nanoindentation technique. The hardnesses of the pure Ag and the Ag solders doped with Pd:3%, Pd:5%, and Pd:2%-Au:3% were 0.6 +/- 0.1, 1.8 +/- 02, 2.8 +/- 03, and 3.1 +/- 0.5 GPa, respectively. Although the hardness of the Ag solder was enhanced significantly when it contained Pd:2%-Au:3%, it exhibited a lower creep exponent (n > 2). The mechanism of the thermal recovery of the sample appears to be associated with activation of dislocation sources-also the reason for the decrease in hardness. The compounds doped with Pd:2%-Au:3% displayed significantly greater bond strengths and creep exponents, whereas the Pd only compounds exhibited poorer reliability. (C) 2017 Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.microrel.2017.05.037
http://hdl.handle.net/11536/144218
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2017.05.037
期刊: MICROELECTRONICS RELIABILITY
Volume: 79
起始頁: 270
結束頁: 275
Appears in Collections:Articles