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dc.contributor.authorTang, Pao-Yunen_US
dc.contributor.authorSun, Wei-Haoen_US
dc.contributor.authorYang, Kei-Hsiungen_US
dc.date.accessioned2018-08-21T05:56:29Z-
dc.date.available2018-08-21T05:56:29Z-
dc.date.issued2009-01-01en_US
dc.identifier.urihttp://hdl.handle.net/11536/146257-
dc.description.abstractA novel composite bump, Smart bump, structure has been successfully developed for chip-on-glass (COG) package using non-conductive adhesive film (NCF). We have successfully verified the low contact resistance and high reliabilities using Smart bump and COG NCF process for the packages of 17"W, 12.1" and 2.4" TFT-LCD modules. We have realized that COG NCF process with Smart bump is simpler and lower cost in consumable materials than the conventional COG ACF process with Au bump. The COG NCF process also allows fine-pitch-driver package for high-resolution TFT-LCDs, and has a higher process yield in pilot production.en_US
dc.language.isoen_USen_US
dc.titleA Novel Composite Bump Design for Chip-on-Glass Package Using Non-Conductive Adhesive Filmen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - IIIen_US
dc.citation.spage834en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000272997600216en_US
Appears in Collections:Conferences Paper


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