A Novel Composite Bump Design for Chip-on-Glass Package Using Non-Conductive Adhesive Film

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Tang, Pao-Yun	en_US
dc.contributor.author	Sun, Wei-Hao	en_US
dc.contributor.author	Yang, Kei-Hsiung	en_US
dc.date.accessioned	2018-08-21T05:56:29Z	-
dc.date.available	2018-08-21T05:56:29Z	-
dc.date.issued	2009-01-01	en_US
dc.identifier.uri	http://hdl.handle.net/11536/146257	-
dc.description.abstract	A novel composite bump, Smart bump, structure has been successfully developed for chip-on-glass (COG) package using non-conductive adhesive film (NCF). We have successfully verified the low contact resistance and high reliabilities using Smart bump and COG NCF process for the packages of 17"W, 12.1" and 2.4" TFT-LCD modules. We have realized that COG NCF process with Smart bump is simpler and lower cost in consumable materials than the conventional COG ACF process with Au bump. The COG NCF process also allows fine-pitch-driver package for high-resolution TFT-LCDs, and has a higher process yield in pilot production.	en_US
dc.language.iso	en_US	en_US
dc.title	A Novel Composite Bump Design for Chip-on-Glass Package Using Non-Conductive Adhesive Film	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III	en_US
dc.citation.spage	834	en_US
dc.contributor.department	交大名義發表	zh_TW
dc.contributor.department	National Chiao Tung University	en_US
dc.identifier.wosnumber	WOS:000272997600216	en_US
顯示於類別：	會議論文