High Performance Cu-doped SiO2 ReRAM by a Novel Chemical Soak Method

Abstract

In this paper, a novel chemical soak method is proposed to fabricate a Cu-doped SiO2 ReRAM device. This method can easily fabricate a lightly Cu-doped SiO2 film and effectively improve the reliability of the conventional Cu-doped SiO2 ReRAM device. A reproducible bipolar switching characteristic with set/reset voltage (ca. 2.5 V/ -0.7 V) is performed in this device and the electrical conduction in HRS and LRS are related to Poole-Frenkel and Ohmic conduction, respectively. Excellent performance in terms of high on/off ratio (similar to 10(6)), narrow range distribution of set and reset voltages, stable data retention, and up to 110 times switching cycles has been achieved by this novel chemical soak method for Cu-doped SiO2 ReRAM device.