A LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE

標題:	A LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE
作者:	Yang, Tsung-Han Guo, Zi-Li Fu, Yu-Min Cheng, Yu-Ting Song, Yen-Fang Wu, Pu-Wei 加速器光源科技與應用學位學程電子工程學系及電子研究所 Master and Ph.D. Program for Science and Technology of Accelrrator Light Source Department of Electronics Engineering and Institute of Electronics
公開日期:	1-Jan-2017
摘要:	The paper presents a low temperature (with 60 degrees C) inkjet printing and filling process to realize low resistive Ag TSV (Through Substrate Vias) with the aspect ratio of via depth vs. diameter from 2 to 5 in a SU-8 substrate potential for flexible microsystem packaging applications. Combining humidity control and layer-by-layer Ag mirror reaction, the proposed process technology can accomplish a fully filled TSV with the lowest electrical resistivity of similar to 450 mu Omega.cm in comparison with the prior printing and filling technologies.
URI:	http://hdl.handle.net/11536/146590
ISSN:	1084-6999
期刊:	30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017)
起始頁:	749
結束頁:	752
Appears in Collections:	Conferences Paper