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dc.contributor.authorChen, Tsan-Wenen_US
dc.contributor.authorTsai, Ping-Yuanen_US
dc.contributor.authorYu, Jui-Yuanen_US
dc.contributor.authorLee, Chen-Yien_US
dc.date.accessioned2014-12-08T15:20:39Z-
dc.date.available2014-12-08T15:20:39Z-
dc.date.issued2011-11-01en_US
dc.identifier.issn0018-9200en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JSSC.2011.2164133en_US
dc.identifier.urihttp://hdl.handle.net/11536/14682-
dc.description.abstractLinear amplification with nonlinear components (LINC) is an attractive technique for achieving linear amplification with high efficiency. This paper presents a sub-mW all-digital signal component separator (SCS) design for OFDM LINC transmitters, including a phase calculator and a digital-control phase shifter (DCPS) pair. In addition, a digital mismatch compensation scheme is proposed and integrated into the SCS to reduce the design complexity of the power amplifier. This chip is manufactured in a 90 nm standard CMOS process with an active area of 0.06 mm(2). The DCPS can generate phase-modulated signals at 100 MHz with 8-bit resolution and RMS error 9.33 ps (0.34 degrees). The phase calculation can be performed at a maximum speed of 50 MHz using a 0.5 V supply voltage, resulting in a 73.88% power reduction. Comparing to state-of-the-art, the power consumption of the overall SCS is only 949.5 mu W which minimizes the power overhead for an LINC transmitter. This SCS with the branch mismatch compensation provides a 0.02 dB gain and 0.15 degrees phase fine-tune resolution without adding additional front-end circuits. Considering 1 dB gain and 10 degrees phase mismatch, the system EVM of -29.81 dB and ACPR of -34.56 dB can still be achieved for 5 MHz bandwidth 64-QAM OFDM signals.en_US
dc.language.isoen_USen_US
dc.subjectBranch imbalanceen_US
dc.subjectefficiencyen_US
dc.subjectLINCen_US
dc.subjectmismatchen_US
dc.subjectOFDMen_US
dc.subjectoutphasingen_US
dc.subjectSCSen_US
dc.titleA Sub-mW All-Digital Signal Component Separator With Branch Mismatch Compensation for OFDM LINC Transmittersen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/JSSC.2011.2164133en_US
dc.identifier.journalIEEE JOURNAL OF SOLID-STATE CIRCUITSen_US
dc.citation.volume46en_US
dc.citation.issue11en_US
dc.citation.spage2514en_US
dc.citation.epage2523en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000296234100008-
dc.citation.woscount2-
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