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dc.contributor.authorLin, Yu-Hsuanen_US
dc.contributor.authorHo, Yung-Hanen_US
dc.contributor.authorLee, Ming-Hsiuen_US
dc.contributor.authorWang, Chao-Hungen_US
dc.contributor.authorLin, Yu-Yuen_US
dc.contributor.authorLee, Feng-Mingen_US
dc.contributor.authorHsu, Kai-Chiehen_US
dc.contributor.authorTseng, Po-Haoen_US
dc.contributor.authorLee, Dai-Yingen_US
dc.contributor.authorChiang, Kuang-Haoen_US
dc.contributor.authorWang, Keh-Chungen_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.contributor.authorLu, Chih-Yuanen_US
dc.date.accessioned2018-08-21T05:56:59Z-
dc.date.available2018-08-21T05:56:59Z-
dc.date.issued2017-01-01en_US
dc.identifier.issn2380-9248en_US
dc.identifier.urihttp://hdl.handle.net/11536/146906-
dc.description.abstractFor the first time the retention of high resistance state (HRS) in resistive random access memory (ReRAM) is found to compose of three stages - extending tail-bits, distribution shift, and then distribution broadening. This work provides a comprehensive study on the HRS's retention behavior in WOx-based ReRAMs from single device characteristics to group distribution. Different from conventional activation energy (Ea) analysis, the mean and variance of the array distribution are presented to overcome the non-uniform Ea issue. Since the extracted Ea fits well with Vo(2+) (oxygen vacancy) migration characteristics, the three retention stages are suggested to be the competing results from the migration, recombination, and generation of the Vo(2+) and O2- in the gap region. A three-dimensional retention model with kinetic Monte Carlo simulator and trap-assisted tunneling conduction is proposed to discuss the dominating mechanism in different time and temperature scales. The mechanism for random telegraph noise is also included to illustrate the fluctuating nature of the HRS cells.en_US
dc.language.isoen_USen_US
dc.titleA Comprehensive Study of 3-stage High Resistance State Retention Behavior for TMO ReRAMs from Single Cells to a Large Arrayen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000424868900008en_US
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