標題: Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration Applications
作者: Huang, Yen-Jun
Chen, Hsiu-Chi
Yu, Ting-Yang
Lai, Bo-Hung
Shih, Yu-Chiao
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-一月-2017
摘要: In this work, hybrid bonding platform is successfully developed with solder bonding and photosensitive polyimide (PI) at 250 degrees C. Since solder may be affected by the curing process of polymer owing to its low melting point; an asymmetry hybrid bonding structure is proposed to overcome this issue. Metal and polymer can be well bonded simultaneously with wide integration flexibility through various ratios of polymer to metal. The mechanical strength of bonded structure is substantially improved with the better use of polymer filling in the extra areas between metal lines. The developed hybrid bonding structure shows excellent electrical characteristics and high wafer level uniformity. Furthermore, the bonded samples also show excellent reliability to endure temperature variation and humidity erosion after temperature cycling test and un-bias highly accelerated stress test. With the advantages of dielectric photosensitivity, excellent bonding qualities, high process flexibilities, strong mechanical strength, good electrical pertbrmance and high stability, the hybrid bonding structures have the outstanding potential to be used in future 3D heterogeneous applications.
URI: http://hdl.handle.net/11536/147173
ISSN: 2150-5934
期刊: 2017 12TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)
起始頁: 187
結束頁: 190
顯示於類別:會議論文