標題: Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps
作者: Shen, Yu-An
Ouyang, Fan-Yi
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Diffusion;Grain boundary;Grain orientation;Intermetallic compounds;Thermomigration
公開日期: 1-Feb-2019
摘要: The effect of Sn orientation on thermomigration was investigated in Cu/Sn2.3Ag/Ni microbumps with diameter of 20 mu m. Results showed that anisotropic diffusion of Cu in Sn grains affected both formation rates and locations of Cu6Sn5 intermetallic compounds (IMCs). Rapid growth of Cu6Sn5 IMCs at the coldend interface was observed when the c-axis of Sn grains was parallel to the temperature gradient. In addition, diffusion of Cu atoms was blocked by a Sn grain with a high angle between the Sn c-axis and the thermal gradient, resulting in formation of Cu6Sn5 IMCs near the grain boundary inside the solder. (C) 2018 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.matlet.2018.10.112
http://hdl.handle.net/11536/148480
ISSN: 0167-577X
DOI: 10.1016/j.matlet.2018.10.112
期刊: MATERIALS LETTERS
Volume: 236
起始頁: 190
結束頁: 193
Appears in Collections:Articles