完整後設資料紀錄
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dc.contributor.authorChuang, HFen_US
dc.contributor.authorLee, CPen_US
dc.contributor.authorTsai, CMen_US
dc.contributor.authorLiu, DCen_US
dc.contributor.authorTsang, JSen_US
dc.contributor.authorFan, JCen_US
dc.date.accessioned2019-04-02T05:59:16Z-
dc.date.available2019-04-02T05:59:16Z-
dc.date.issued1998-01-01en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.366692en_US
dc.identifier.urihttp://hdl.handle.net/11536/148534-
dc.description.abstractWe studied the thermal reaction of Pd/In0.52Al0.48As contacts using capacitance-voltage (C-V), current-voltage, Auger electron spectroscopy, and x-ray diffraction analyses and compared the results to those for Pd/Al0.25Ga0.75As and Pd/In0.53Ga0.47As contacts. The thickness of InAlAs consumed by the reaction during annealing was calculated directly from the measured C-V profiles. Pd starts to react with InAlAs at a temperature of 100 degrees C, lower than it does with AlGaAs. For thermally annealed Pd/InAlAs and Pd/AlGaAs, both compositional and structural changes were found at the Pd/semiconductor interface. However, in heat-treated Pd/InGaAs samples, compositional changes but no structural changes were observed. (C) 1998 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleThermal annealing of Pd/InAlAs Schottky contacts for transistor buried-gate technologiesen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.366692en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume83en_US
dc.citation.spage366en_US
dc.citation.epage371en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000071320400052en_US
dc.citation.woscount10en_US
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