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dc.contributor.authorLin, Chun-Anen_US
dc.contributor.authorHuang, Chu-Jieen_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.date.accessioned2019-04-02T05:58:42Z-
dc.date.available2019-04-02T05:58:42Z-
dc.date.issued2019-03-04en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.5087421en_US
dc.identifier.urihttp://hdl.handle.net/11536/149003-
dc.description.abstractIn this letter, we report the impact of the barrier layer on the performance of HfO2-based conductive bridge RAM (CBRAM) devices with TeTiW as the source layer. The considerable improvement of retention in the CBRAM device using TiW as the barrier layer is attributed to the lower amount of oxygen vacancies in the switching layer, which is justified from the O1s core level in X-ray photoelectron spectroscopy analyses. Therefore, the diffusion of Te in the resistive layer of the device with the TiW barrier layer is limited even at high temperature. The TeTiW/TiW/HfO2/TiN CBRAM device provides an excellent endurance of more than 10(4) cycles, with an on/off ratio of 200. Such a device also features long retention for up to 10(4) s at 200 degrees C.en_US
dc.language.isoen_USen_US
dc.titleImpact of barrier layer on HfO2-based conductive bridge random access memoryen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.5087421en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume114en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000460820600041en_US
dc.citation.woscount0en_US
Appears in Collections:Articles