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dc.contributor.authorHuang, CTen_US
dc.contributor.authorChang, PHen_US
dc.contributor.authorShie, JSen_US
dc.date.accessioned2019-04-02T05:59:10Z-
dc.date.available2019-04-02T05:59:10Z-
dc.date.issued1996-06-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1836946en_US
dc.identifier.urihttp://hdl.handle.net/11536/149203-
dc.description.abstractThe deposition rate of SiO2 by liquid-phase deposition (LPD) in a H2SiF6 solution is significantly increased by 254 nm ultraviolet (UV) illumination. The photoenhancement effect is much stronger at 3.09 M H2SiF6 than at 1.34 M H2SiF6 concentration. At a constant boric acid concentration the deposition rate of SiO2 is found to increase linearly with UV light intensity. The photoassisted effect is much stronger at higher boric acid concentration. However, within the UV intensity range studied, the photoeffect on the oxide growth rate is not as strong as other parameters such as H2SiF6 concentration and boric acid addition. The UV spectrophotometric results show that the strong UV absorption of the growth solution is associated with SiF62- but not with H2O, H3BO3, or BF4- species in the solution. The observed photoenhancement effect is discussed in the light of the existing LPD models.en_US
dc.language.isoen_USen_US
dc.titlePhotoassisted liquid-phase deposition of silicon dioxideen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1836946en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume143en_US
dc.citation.spage2044en_US
dc.citation.epage2048en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department光電工程研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentInstitute of EO Enginerringen_US
dc.identifier.wosnumberWOS:A1996UQ66200056en_US
dc.citation.woscount3en_US
Appears in Collections:Articles