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dc.contributor.authorLiu, Kou-Chenen_US
dc.contributor.authorTzeng, Wen-Hsienen_US
dc.contributor.authorChang, Kow-Mingen_US
dc.contributor.authorChan, Yi-Chunen_US
dc.contributor.authorKuo, Chun-Chihen_US
dc.contributor.authorCheng, Chun-Wenen_US
dc.date.accessioned2019-04-02T05:58:00Z-
dc.date.available2019-04-02T05:58:00Z-
dc.date.issued2010-05-01en_US
dc.identifier.issn0026-2714en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.microrel.2010.02.006en_US
dc.identifier.urihttp://hdl.handle.net/11536/149966-
dc.description.abstractWe successfully fabricated the Gd2O3 film for the application of resistive random access memory (RRAM). The resistive switching behavior of the Ti/Gd2O3/Pt capacitor structure could be both operated under positive or negative bias. However, there was a significant difference on the switching properties. The switching behavior under positive bias operation was more stable, had less voltage and resistance fluctuation, and had longer endurance than that of the negative one. We propose that the anode electrode plays an important role in the switching characteristics and may be the cause of the asymmetry of the I-V curves between positive and negative operation. (C) 2010 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleThe resistive switching characteristics of a Ti/Gd2O3/Pt RRAM deviceen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.microrel.2010.02.006en_US
dc.identifier.journalMICROELECTRONICS RELIABILITYen_US
dc.citation.volume50en_US
dc.citation.spage670en_US
dc.citation.epage673en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000278728700022en_US
dc.citation.woscount37en_US
Appears in Collections:Articles