完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Tsai, C. Y. | en_US |
dc.contributor.author | Wu, T. L. | en_US |
dc.contributor.author | Chin, Albert | en_US |
dc.date.accessioned | 2014-12-08T15:21:10Z | - |
dc.date.available | 2014-12-08T15:21:10Z | - |
dc.date.issued | 2012-01-01 | en_US |
dc.identifier.issn | 0741-3106 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/LED.2011.2172911 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/15019 | - |
dc.description.abstract | Using a high-k LaAlO(3)/SiO(2) gate dielectric, the recessed-gate GaN MOSFET has a low threshold voltage (V(t)) of 0.1 V, low on-resistance (R(on)) of 13.5 Omega . mm, high breakdown voltage of 385 V, high transconductance (g(m)) of 136 mS/mm, and record-best normalized drive current (mu C(ox)) of 172 mu A/V(2). Such excellent device integrity is due to the small capacitance equivalent thickness of 3.0 nm, using a high-k gate dielectric and recessed-gate etching. | en_US |
dc.language.iso | en_US | en_US |
dc.title | High-Performance GaN MOSFET With High-k LaAlO(3)/SiO(2) Gate Dielectric | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/LED.2011.2172911 | en_US |
dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
dc.citation.volume | 33 | en_US |
dc.citation.issue | 1 | en_US |
dc.citation.spage | 35 | en_US |
dc.citation.epage | 37 | en_US |
dc.contributor.department | 電機工程學系 | zh_TW |
dc.contributor.department | Department of Electrical and Computer Engineering | en_US |
顯示於類別: | 期刊論文 |