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dc.contributor.authorKer, Ming-Donen_US
dc.contributor.authorLin, Chun-Yuen_US
dc.contributor.authorWu, Yi-Hanen_US
dc.contributor.authorWang, Wen-Taien_US
dc.date.accessioned2019-04-02T06:04:53Z-
dc.date.available2019-04-02T06:04:53Z-
dc.date.issued2017-01-01en_US
dc.identifier.issn2379-7711en_US
dc.identifier.urihttp://hdl.handle.net/11536/150781-
dc.description.abstractOn-chip electrostatic discharge (ESD) protection design with low-leakage consideration for the silicon chips of IoT applications is presented. The proposed ESD protection design uses the fast turn-on silicon-controlled rectifier (SCR) device to implement the power-rail ESD clamp circuit. Experimental results verified in TSMC 28nm CMOS process have shown that the proposed design has advantages of low leakage current (2 similar to 3nA), low trigger voltage (similar to 2V), high ESD robustness (>8kV), and free to latchup issue.en_US
dc.language.isoen_USen_US
dc.subjectCMOSen_US
dc.subjectelectrostatic discharge (ESD)en_US
dc.subjectESD protectionen_US
dc.subjectlow-leakageen_US
dc.titleESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applicationsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2017 IEEE 7TH ANNUAL INTERNATIONAL CONFERENCE ON CYBER TECHNOLOGY IN AUTOMATION, CONTROL, AND INTELLIGENT SYSTEMS (CYBER)en_US
dc.citation.spage1496en_US
dc.citation.epage1499en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000447628700269en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper