完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Ker, Ming-Don | en_US |
dc.contributor.author | Lin, Chun-Yu | en_US |
dc.contributor.author | Wu, Yi-Han | en_US |
dc.contributor.author | Wang, Wen-Tai | en_US |
dc.date.accessioned | 2019-04-02T06:04:53Z | - |
dc.date.available | 2019-04-02T06:04:53Z | - |
dc.date.issued | 2017-01-01 | en_US |
dc.identifier.issn | 2379-7711 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/150781 | - |
dc.description.abstract | On-chip electrostatic discharge (ESD) protection design with low-leakage consideration for the silicon chips of IoT applications is presented. The proposed ESD protection design uses the fast turn-on silicon-controlled rectifier (SCR) device to implement the power-rail ESD clamp circuit. Experimental results verified in TSMC 28nm CMOS process have shown that the proposed design has advantages of low leakage current (2 similar to 3nA), low trigger voltage (similar to 2V), high ESD robustness (>8kV), and free to latchup issue. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | CMOS | en_US |
dc.subject | electrostatic discharge (ESD) | en_US |
dc.subject | ESD protection | en_US |
dc.subject | low-leakage | en_US |
dc.title | ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2017 IEEE 7TH ANNUAL INTERNATIONAL CONFERENCE ON CYBER TECHNOLOGY IN AUTOMATION, CONTROL, AND INTELLIGENT SYSTEMS (CYBER) | en_US |
dc.citation.spage | 1496 | en_US |
dc.citation.epage | 1499 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000447628700269 | en_US |
dc.citation.woscount | 0 | en_US |
顯示於類別: | 會議論文 |