Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration

標題:	Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration
作者:	Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics
公開日期:	1-Jan-2018
URI:	http://hdl.handle.net/11536/151067
期刊:	2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)
起始頁:	79
結束頁:	79
Appears in Collections:	Conferences Paper