標題: Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration
作者: Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Jan-2018
URI: http://hdl.handle.net/11536/151067
期刊: 2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)
起始頁: 79
結束頁: 79
Appears in Collections:Conferences Paper