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dc.contributor.authorLu, C. C.en_US
dc.contributor.authorCheng, C. C.en_US
dc.contributor.authorChiu, H. P.en_US
dc.contributor.authorLin, W. L.en_US
dc.contributor.authorChen, T. W.en_US
dc.contributor.authorKu, S. H.en_US
dc.contributor.authorTsai, Wen-Jeren_US
dc.contributor.authorLu, T. C.en_US
dc.contributor.authorChen, K. C.en_US
dc.contributor.authorWang, Tahuien_US
dc.contributor.authorLu, Chih-Yuanen_US
dc.date.accessioned2019-04-02T06:04:37Z-
dc.date.available2019-04-02T06:04:37Z-
dc.date.issued2018-01-01en_US
dc.identifier.issn2380-9248en_US
dc.identifier.urihttp://hdl.handle.net/11536/151101-
dc.description.abstractFeasibility of multi-times verify (MTV) scheme on triple-level cell (TLC) and quad-level cell (QLC) operations of charge-trap storage 3D NAND memories is investigated comprehensively. Results reveal that random telegraph noise (RTN) and program noise are the major factors affecting lower (LB) and upper boundaries (HB) of Vt distribution, respectively. Enlargement of operation window and reduction of ECC usage with MTV scheme to mitigate RTN-induced LB tail are demonstrated on TLC and QLC operations. In addition, the impact of program noise on HB Vt under various process conditions and ISPP steps is studied experimentally and also explained by our Monte Carlo simulator. Finally, program performance and reserved margin with and without MTV scheme applied on TLC and QLC operation are demonstrated.en_US
dc.language.isoen_USen_US
dc.titleAnalysis and Realization of TLC or even QLC Operation with a High Performance Multi-times Verify Scheme in 3D NAND Flash memoryen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2018 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000459882300069en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper